IT communication
3C product also calls information home appliance, it is to show computer kind communication kind and consumer kind electronic product commonly. Various kinds of market demand are large. China has become the largest consumer market in the world for 3C products. With the improvement of national economic level and income level, Chinese has put forward higher requirements for the quality of electronic products. Businesses have launched products with higher configuration, higher performance and better design to satisfy consumers.

There are many factors affecting the quality of electronic products, among which heat dissipation is a non-negligible factor. Especially after the "samsung battery gate" incident in 2016, electronic manufacturers pay more attention to the heat dissipation performance and safety of products. How to ensure that the heat dissipation of electronic products in line with the stringent design requirements? Planning thermal management issues at the beginning of the product design cycle is the best way to achieve the most efficient cooling solutions. As the first-class heat dissipation technology service provider in China, TONGYU Thermal can provide IT communication electronic products cooling solutions, involving: board (motherboard) cooling, CPU cooling, graphics card cooling, radio frequency module cooling, RU cooling, game console cooling, VR cooling, industrial control computer (machine) cooling, server cooling, central variable frequency air conditioning cooling, TEC cooling and other fields.
Customer SVG heat dissipation design requirements are as follows
PCB source Temperature ≤100℃
CPU Temperature ≤100℃
DC Output Conductivity:10W/(m*K) Power:5W
CPU Chipset Conductivity:10W/(m*k) Power:10W
PCB MST Conductivity:15W/(m*K) Power:5W
CPU PCB Conductivity:15W/(m*K) Power:4W
CPU Heatsink Size:125*95*6mm,Substrate thickness:2mm,fin Number: 10pcs, Thickness:0.6mm;Conductivity: AL-extru. 180W/(m*K).
CU Block Size:41*41*4.7,Conductivity:385 W/(m*k)
Thermal paste Thickness: 0.3mm,Conductivity:3.5W/(m*K)
Welding mode Soldering4258,Conductivity:48W/(m*k) 0.2mm
Front of grille Size:170*27mm,Opening rate:0.5
Grille right Size:35*30 mm,Opening rate:0.6
Grille back Size:30*30 mm,Opening rate::0.7
fan Size:30*30*10 mm
Top of PCB Size:140*170mm,Conductivity:10W/(m*k),Power:3W
Inverse side of heat source body 0.8W/pcs
Front of heat source Left row:0.8W/pcs,Right row: 1.2W/pcs,Marked as “2”This row :1.5W/pcs.
Heatsinks Size:140*170*4.5mm,Substrate thickness:2mm,fin Height:2.5mm, Fin Number:10pcs,fin Thickness:0.6mm,Conductivity:180W/(m*K).
Thermal paste Thickness:0.3mm,Conductivity:3.5W/(m*K).
Bottom of PCB Size:140*170mm,Conductivity:10W/(m*k),Power:3W。
Source of inverse Power:1.5W/pcs
Heatsink Size:140*170*4.5mm,Substrate thickness:2mm,fin Height:2.5mm,Fin Number:10pcs,fin Thickness:0.6mm,Conductivity:180W/(m*K).
Thermal paste Thickness: 0.3mm,Conductivity:3.5W/(m*K).
Description of Radiator Heat Dissipation Solutions
(1)Add one more 30*10mm Axial-flow fan, increase air flow through RX module; (2)Modify the copper fins in front of the fan to increase the air flow in the system.
Schematic diagram of simulation model for overall layout of heat dissipation
Schematic diagram of simulation model for overall layout of heat dissipation
Copper fin Size:30*12*0.3mm,Tilt:1.0,Number:30pcs.
Material Science:C1100,Conductivity:385W/(m*K).
Heat pipe D6 Tube thickness:3mm,Pressing process, heat pipe type: powder sintering,Conductivity:10000W/(m*k).
Adding a 30*10 mm axial flow fan, the opening ratio of the new fan opening area 0.7.
A partition Size:160*33*0.5mm,Material Science: Stainless steel.
CPU Temperature and Airflow Distribution Diagram of Module Simulation
ambient temperature: 40℃; CPU Chipset Maximum Temperature:64.43℃.
CPU Temperature and Airflow Distribution Diagram of Module Simulation
CPU Fan Operating Point: Volume flow:2.43ft^3/min Pressure:17.47Pa.
RX Temperature Distribution Diagram of Module Top Simulation
RX Temperature Distribution Diagram of Module Top Simulation
NO. Maximum temperature NO. Maximum temperature NO. Maximum temperature
Source 1 59.43 Source 1.7 59.73 Source 3.1 59.59
Source 1.1 59.54 Source 2 60.02 Source 3.2 59.7
Source 1.2 59.66 Source 2.1 60.19 Source 3.3 59.77
Source 1.3 59.73 Source 2.2 60.16 Source 3.4 59.8
Source 1.4 59.76 Source 2.3 59.96 Source 3.5 59.8
Source 1.5 59.77 Source 2.4 59.96 Source 3.6 59.78
Source 1.6 59.76 Source 3 59.48 Source 3.7 59.74
NO. Maximum temperature NO. Maximum temperature
Source 4 60.83 Source 4.4 60.95
Source 4.1 60.53 Source 4.5 60.89
Source 4.2 60.92 Source 4.6 60.8
Source 4.3 60.96 Source 4.7 60.67
Fan operating point:
           CPU fan: 2.43ft^3/min ,17.47Pa;
             RX fan1: 2.23ft^3/min ,18.65Pa;
             RX fan2: 2.5ft^3/min ,17.09Pa;
             RX fan3:2.22ft^3/min,18.70Pa。
Fan grille window airflow:
           CPU grille:2.26ft^3/min;
             RX grille1:1.95 ft^3/min;
             RX grille2:2.23 ft^3/min;
             RX grille3:1.962ft^3/min;
             Total: 8.4ft^3/min。
RX Temperature Distribution Diagram of Module Bottom Simulation
Summary of simulation results of heat dissipation solutions
  CPU Maximum temperature(℃) Temperature range of heat source(℃) System airflow(ft^3/min)
Simulation results of the scheme 64.43 60.92~59.43 8.4
It meets the requirements of CPU temperature less than 80 C and heat source body temperature less than 100 C, and completes the heat dissipation design requirements.
Has a complete integrated service system: including the early engineering and technical personnel to quickly answer the technical advice, to respond to your needs, to develop suitable products for you, to provide reasonable and reliable advice;Commitment to product quality, delivery time, to provide specific cooling solutions.We will continue to strive to provide you with the best quality products and services.
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